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ECCOBOND NCP 5209, 10 cc by LOCTITE
4.4 (105 items)
Limited Time SaleUntil the end
03
44
21
US$54.00 cheaper than the new price!!
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Used US$36.00
Product details
| Management number | 211285224 | Release Date | 2026/04/04 | List Price | US$36.00 | Model Number | 211285224 | ||
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| Category | |||||||||
LOCTITE ECCOBOND NCP 5209 is a light yellow, acrylic-based, non-conductive die adhesive suitable for applying to premium flip chip copper fillers. It employs robust bump protection via thermal compression bonding. Suitable for narrow or fine-pitch assemblies, it's typically used as a pre-applied underfill to create optimal fluxing action and excellent solder joints. It cures rapidly upon exposure to heat.
- Eliminates Ionic Impurities: This product effectively removes ionic impurities
- Rapid Curing: It cures quickly, ensuring efficient bonding
- Non-Conductive: It's designed to be non-conductive, preventing electrical shorts
- Effective Protection for Electrical Joints: It provides robust protection for electrical joints
| Brand Name | Loctite |
|---|---|
| Manufacturer | LOCTITE |
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